Most PCB manufacturers currently using direct repeat of the silver back of the silver or silver again after retirement to handle the PCB directly not on the silver, silver-based Bank of defects and poor 

 Direct repeat of either silver or silver back silver again after these exists in the way of danger are high: 1, by Gu Fani effect can easily result in an open position and the neck on the line in the customer simply mount this problem before can not be found: 
 Even more frightening is sometimes duplication of silver neck position does not appear completely open (there are some connected), to be customer mounting pressure after the test had been high for this position will blow off, resulting in irreparable consequences; 
 Silver had a number of PCB manufacturers because of this problem and had to pay substantial damages to the cost of customer 
 2, can not guarantee that the requirements of thick copper 
 Repeat the replacement reaction of silver will result when the bare copper surface copper thickness can not meet customer requirements, back again after Bank of silver is greater risk exists 

 3, can easily result in green oil (solder) or fall off the bubble 
 Withdrawal of silver and silver syrup were highly acidic, to green oil (solder) there is a big edge are bound to the role of lateral erosion, causing the oil bubble, or off the green 
 4, the cost of greatly increased;; 
 Silver of Silver is not only a repeat of their high cost and energy consumption provinces, labor costs, the supporting material costs also increased significantly 

 5, longer product cycle times 
 Silver is often caused by repeated products of the manufacturing cycle considerably longer, and repeat of the silver again after repeated testing, even the secondary pollution caused by products. 
 The product: chemical make up of silver solution, through chemical repair method is simple, quick silver PCB surface of silver on the negative, not on the silver of silver defects and effective PCB repair; 

 When the patch because this product is only in contact with the defect sites, will not affect other parts of the PCB, which will not bring adverse effects described above; 

 The product is extremely simple, without any experience of the operator, yield up to 100% patches; 
 By pollution, solderability, adhesion, the reliability of silver thick and a series of tests, will make you greatly reduce the cost of scrap silver process will plummet; 

 Repair this product without fear of silver plate reliability problems occur, there will be no risk of high claims; 

 PCB using this product can make significantly reduce manufacturing cycle times, enhanced market competitiveness.